The global electronics industry is entering a new era marked by rapidly increasing product complexity, ranging from printed circuit boards (PCBs) and AI computing infrastructure to semiconductor technologies and advanced chip packaging. As a result, Failure Analysis, the science of identifying and understanding the root causes of product failures, has become a crucial discipline for improving product quality, reliability, and global competitiveness.
At the THPCA Conference: Engineering Solutions Through Failure Analysis, organized by the Thailand Printed Circuit Association (THPCA), leading experts from Thailand’s electronics industry gathered to exchange knowledge and practical experiences on failure analysis methodologies and preventive strategies for next-generation electronic systems.
According to Mr. Swaek Prakitritanon, Vice President and Secretary of Thailand Printed Circuit Association (THPCA) and President of Auramex Co., Ltd., Thailand is playing an increasingly important role in the global electronics supply chain, particularly in the PCB sector, where many world-class manufacturers continue to expand their investments in the country.
However, future competitiveness will not be determined solely by manufacturing capacity or investment levels. Equally important is the ability to manage product quality and reliability, especially in high-performance applications such as AI servers, high-speed communications systems, intelligent vehicles, and aerospace technologies.
Mr. Pullop Tangbovonpechet, Engineering Director of Sanmina-SCI Systems (Thailand) Co.,Ltd., shared insights from the Electronics Manufacturing Services (EMS) sector, emphasizing that one of today’s greatest challenges lies in identifying hidden defects within electronic assemblies that cannot be detected through conventional testing methods.
With the growing complexity of modern electronics, particularly in hyper-scale computing and data center applications, understanding failure mechanisms at the material, manufacturing, and operational levels has become essential for preventing issues that could affect users worldwide.
Representatives from Celestica (Thailand) Co.,Ltd. also presented perspectives on the challenges associated with next-generation AI hardware. The session was delivered by Mr. Anak Chobdhama, Director, Test Engineering Ms. Nattaporn Phunnarungsi, Manager, MFG Process Engineering (FA Lab) Mr. Pitak Khaimanee, Senior Lead Manager, MFG Process Engineering (FA Lab).
The Celestica engineering team highlighted the increasing complexity of AI infrastructure systems, which must support high-speed data transmission, advanced power management, and high-efficiency thermal solutions. These challenges require sophisticated analytical techniques to maintain system stability and maximize equipment performance.
From the semiconductor sector, Ms. Yuwadee Kaewsathorn Manager, Failure Analysis and Reliability Test UTAC Thailand Co.,Ltd, presented approaches for analyzing and validating the reliability of increasingly sophisticated semiconductor devices, including Stacked Die, Flip Chip, and System-in-Package (SiP) technologies.
Particularly in automotive and safety-critical electronics applications, failure analysis extends beyond identifying the root cause of defects. It serves as a fundamental process for ensuring long-term product reliability and building customer confidence throughout a product’s lifecycle.
Industry experts unanimously agreed that the future growth of the electronics sector will require close collaboration among manufacturers, researchers, academic institutions, and failure analysis specialists. Such cooperation is essential for generating new knowledge and developing a highly skilled workforce capable of supporting increasingly advanced technologies.
These critical industry insights will be further explored at Thailand Electronics Circuit Asia 2026 (THECA 2026), Asia’s premier international exhibition and conference for PCB, PCBA, EMS, Semiconductor, and Advanced Electronics technologies. The event will take place from 26–28 August 2026 at BITEC Hall 98–99, Bangkok, under the theme “Innovating PCB and Advanced Electronics with Next-Gen Packaging.”
Beyond showcasing the latest innovations and technologies from leading global companies, THECA 2026 will place strong emphasis on workforce development through its dedicated Workforce Pavilion. This special platform will connect industry leaders, educational institutions, and individuals seeking career opportunities in the electronics sector. Participants will gain valuable insights into career pathways, in-demand skills, and employment trends across PCB, Semiconductor, EMS, and Advanced Electronics industries, all of which are experiencing growing demand for qualified talent.
The event will also feature more than 50 conference sessions and technical seminars led by internationally recognized experts, covering a broad range of topics including PCB, PCBA, EMS, Semiconductor, AI Infrastructure, Advanced Packaging, Data Centers, Automotive Electronics, Photonics, Smart Manufacturing, and workforce development strategies for the future electronics ecosystem.
Interested visitors can register to attend free of charge at:
https://thecaregistrations.com/Registration/ChooseTypeRegis.aspx?codeInv=THECA2
